Low-warpage lidded flip-chip package on a thin substrate
High-power flip-chip packages must conduct heat into a top-side lid while controlling warpage from thin substrates and molded structures.
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Shinko Electric Industries
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Advanced package substrates · leadframes · IC assembly technologies
HBM2.5D / 3DFCBGACHIPLET / HYBRID BONDINGServer, SSD, imaging and automotive processors
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In a SHINKO thin-substrate lidded flip-chip package, how should lid-attach material, coverage and thickness be co-optimized for package warpage and die/interface stress?
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