Public-source company profile
Siemens Digital Industries Software
Capabilities
Electronics cooling · package thermal characterization · thermo-mechanical workflows
HBM2.5D / 3DFCBGACHIPLET / HYBRID BONDINGPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYPackages, modules and electronic systemsIGBT, SiC and GaN power modules and packages3D ICs, chiplets, stacked die and heterogeneous integration
Thermo-mechanical simulation and lifetime predictionSimcenter 3D coupled thermal-structural simulation
Predicts temperature fields, thermal deformation, interface stress and nonlinear material response through process and operating histories, enabling design and material comparisons.
Official website ↗Official materials
Reliability qualification and failure analysisSimcenter Micred Power Tester for power cycling and failure-in-progress monitoring
Tracks gradual degradation of die attach, solder, wire bonds and thermal interfaces as power modules undergo repeated switching and junction-temperature swings, rather than reporting only the final failure time.
Official website ↗Official materials
Thermo-mechanical simulation and lifetime predictionCalibre 3DStress multiscale stress and warpage analysis for 3D ICs
Assesses package-to-die stress, warpage, cracking risk and stress-driven transistor-mobility shifts from assembly and operating temperatures before 3D-IC or chiplet tapeout and manufacturing.
Official website ↗Official materials
Thermo-mechanical simulation and lifetime predictionIn a Simcenter 3D coupled thermal-structural package model, which PCB, cooling and assembly-history boundary conditions are needed to avoid underestimating warpage?
Reliability qualification and failure analysisDuring power cycling with the Simcenter Micred Power Tester, how should thermal impedance, temperature-sensitive parameters and failure criteria be configured to distinguish die-attach degradation, interconnect fatigue and thermal-path changes driven by package or interface stress?
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