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Sumitomo Bakelite

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Capabilities

Epoxy molding compounds · semiconductor encapsulation materials

HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYLarge AI, 2.xD/3D and chiplet packages

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Related solutions

Material properties and interface engineering

EME-L low-warpage liquid encapsulant

Large 2.xD/3D and chiplet packages are vulnerable to warpage after full encapsulation while still requiring liquid fill performance, downstream handling and process efficiency.

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Official materials

TECHNICAL RELEASETrial launch of liquid encapsulant for advanced packages ↗

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Related questions

Material properties and interface engineering

When evaluating Sumitomo Bakelite EME-L low-warpage liquid encapsulants, how should supplier test-coupon results be translated into risk for the actual product stack and cure profile?

OFFICIAL SUPPLIER ANSWERS

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