Public-source company profile
SUSS MicroTec
Capabilities
Wafer-level metrology · alignment · temporary bond and debond process insight
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGThin wafers, backside processing and 2.5D/3D
Process equipment and thermal controlXBS300 high-precision temporary wafer bonding platform
Bonds device wafers to carriers before thinning, backside processing and 2.5D/3D integration while controlling TTV, overlay and in-process shape to reduce downstream handling and process risk.
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