Public-source company profile
Synopsys
TSV, BEOL, microbumps, solder joints and CPI
Thermo-mechanical simulation and lifetime predictionSentaurus Interconnect process-history stress and interconnect reliability simulation
TSVs, BEOL, microbumps and solder joints accumulate stress through deposition, anneal, cooldown and external loading, potentially causing voids, cracks, debonding or stress migration.
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