Public-source company profile
Thermo Fisher Scientific
2.5D/3D, hybrid bonds, microbumps and TSVs2.5D/3D IC, TSV, stacked die and boards
Reliability qualification and failure analysisHelios 5 PFIB-SEM large-area cross-sectioning and failure analysis for advanced packaging
Buried interconnects, material interfaces and large defects in 2.5D/3D packages are slow to expose with conventional Ga FIB, and preparation damage can obscure real cracks or delamination.
Official website ↗Official materials
Reliability qualification and failure analysisELITE lock-in thermography for 3D electrical fault localization through packages
Shorts, leakage, resistive opens and local anomalous heating in 2.5D/3D packages, stacked dies, TSVs and dense substrates can be buried inside the package, while immediate deprocessing may destroy evidence.
Official website ↗Official materials
Reliability qualification and failure analysisWhen using Thermo Fisher ELITE lock-in thermography to localize intermittent leakage or resistive opens inside a package, how should electrical stimulus and modulation be selected, depth signals interpreted and the true failure site confirmed with X-ray, SAM or PFIB?
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