Public-source company profile
Tokyo Electron
Capabilities
Coater/developer · bonding · cleaning and wafer process equipment
HBM2.5D / 3DFAN-OUT / WLPCHIPLET / HYBRID BONDINGCIS, memory, advanced logic and wafer-to-wafer 3D
Process equipment and thermal controlSynapse Si / ZF 300 mm hybrid bonding with pre-anneal rework
300 mm fusion and Cu hybrid bonding needs more than cleaning, plasma activation and precise alignment; if pre-anneal inspection finds void or overlay issues, a route is needed to reduce whole-wafer scrap risk.
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