Public-source company profile
TOWA Corporation
Capabilities
Compression molding · HBM / 2.5D / 3D packaging · process engineering
HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITYWLP, PLP, HBM and 2.5D/3D packaging
Process equipment and thermal controlCPM1080/CPM1180 wafer and panel compression molding
Provides controlled resin fill, pressure and vacuum for large-format WLP, PLP, HBM, 2.5D/3D and chiplet molding while reducing die stress, voiding and thickness non-uniformity associated with resin flow.
Official website ↗Official materials
Process equipment and thermal controlWhen using TOWA CPM1080/CPM1180 for compression molding, which temperature, pressure, vacuum or tooling conditions are most often overlooked in warpage control?
OFFICIAL SUPPLIER ANSWERS
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