CoWoS-R RDL interposer with CTE-buffering layers
Large HPC multi-die packages need dense die-to-die interconnects while reducing CTE-mismatch strain across the SoC, RDL interposer, C4 and organic substrate.
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TSMC
台灣積體電路製造股份有限公司
Capabilities
HPC/AI multi-die and HBM integration
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