Public-source company profile
Yield Engineering Systems
PLP, large-area RDL, D2P, polyimide and PBO
Process equipment and thermal controlVertaCure PLP vacuum curing for low-warpage panel processing
Nonuniform atmospheric curing, residual solvent or poorly controlled thermal ramps in PLP and large-area RDL polyimide/PBO can drive film stress, outgassing, particles and panel warpage.
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