Xradia Versa non-destructive 3D X-ray microscopy for packages
Images voids, cracks, interconnects and interfaces inside RF, 2.5D/3D and electronic packages before sectioning, guiding targeted follow-on analysis.
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ZEISS Industrial Quality Solutions
Capabilities
X-ray microscopy · CT · dimensional and failure analysis
HBM2.5D / 3DFCBGAFAN-OUT / WLPPOWER SEMICONDUCTORAUTOMOTIVE / HIGH RELIABILITY2.5D, 3D, RF and electronic packages
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