AMB silicon-nitride/thick-copper substrate route
The official AMB page describes substrates made from silicon-nitride ceramic and thick copper for high-power modules.
Required inputs, limitations and sources
Required inputs
Ceramic/copper thicknesses, thermophysical properties and temperature dependence；Actual heat-source area, location and power；Die-attach/TIM thickness and contact conditions；Cooling boundaries, temperature-sensor calibration and known-good controls
Main limitations
Specify layer thicknesses, copper patterns, brazed interfaces, insulation and thermomechanical limits. Engineering project acceptance requires a separate inquiry.；This describes product uses and material structures. It does not establish the initial thermal-resistance bottleneck or improvement for this sample. Confirm actual thicknesses, bonds, thermal boundaries and engineering batch quantities.
Tong Hsing · View source ↗
Official technical summary reviewed · This describes product uses and material structures. It does not establish the initial thermal-resistance bottleneck or improvement for this sample. Confirm actual thicknesses, bonds, thermal boundaries and engineering batch quantities.