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42 candidate solutions
Warpage reversal during cooling in large 2.5D FCBGA packages
Locate the reversal temperature range, then separate material, structural, and boundary effects.
Current candidates
- PS600T / PS600S thermal warpage measurement platformsSupplier / solution source: Akrometrix
- Celsius Studio 3D-IC thermomechanical analysisSupplier / solution source: Cadence
- MCL-E-770G series low-CTE substrate materialsSupplier / solution source: Resonac
- Advanced-packaging multiphysics simulation workflowSupplier / solution source: Ansys
- SR series solder-mask materials for package substratesSupplier / solution source: Resonac
- SUMILITE LαZ low-CTE package-substrate materialsSupplier / solution source: Sumitomo Bakelite
- FALDA heat-curing epoxy adhesive filmSupplier / solution source: Toray Industries
- SB-3300 wafer-backside cleaning and controlled etchSupplier / solution source: SCREEN Semiconductor Solutions
- Producer Avila backside dielectric stress compensationSupplier / solution source: Applied Materials
- Discovery DMA 850 solid-package-material viscoelastic characterizationSupplier / solution source: TA Instruments
- Discovery TMA 450 thermal expansion and shrinkage measurementSupplier / solution source: TA Instruments
- ASE FOPoP fan-out package-on-package platformSupplier / solution source: ASE
- DMA 303 Eplexor cured-material viscoelastic comparisonSupplier / solution source: NETZSCH Analyzing & Testing
- TMA 512 Hyperion expansion and shrinkage comparisonSupplier / solution source: NETZSCH Analyzing & Testing
- Digimat multiphase material-model calibrationSupplier / solution source: MSC Software
- NanoTest Vantage local mechanical characterizationSupplier / solution source: Micro Materials
- Ajinomoto Build-up Film (ABF) for package substratesSupplier / solution source: Ajinomoto Fine-Techno
- Pyramax with TrueFlat advanced-packaging reflow and warpage controlSupplier / solution source: BTU International
- Multilayer ceramic core substrate for advanced HDBU packagingSupplier / solution source: KYOCERA
- COMSOL Multiphysics for semiconductor packagingSupplier / solution source: COMSOL
- TGV glass-core and interposer substrates for advanced packagingSupplier / solution source: AGC
- Simcenter 3D coupled thermal-structural simulationSupplier / solution source: Siemens Digital Industries Software
- Low-warpage lidded flip-chip package on a thin substrateSupplier / solution source: SHINKO ELECTRIC INDUSTRIES
- Abaqus/Standard nonlinear package thermal-stress analysisSupplier / solution source: Dassault Systèmes SIMULIA
- EME-L low-warpage liquid encapsulantSupplier / solution source: Sumitomo Bakelite
- CoWoS-R RDL interposer with CTE-buffering layersSupplier / solution source: TSMC
- KMC low-warpage, thermally conductive epoxy encapsulantsSupplier / solution source: Shin-Etsu Chemical
- S-SWIFT organic RDL fan-out-on-substrate heterogeneous integrationSupplier / solution source: Amkor Technology
- TMA, DMA and DSC thermal characterization for advanced-packaging materialsSupplier / solution source: iST Integrated Service Technology
- IC Packaging Warp simulation for molding, cure and cooldownSupplier / solution source: Moldex3D
- Chipcoat G8345 low-warpage dam-and-fill encapsulantsSupplier / solution source: NAMICS
- FOCoS high-density fan-out chip-on-substrateSupplier / solution source: ASE
- SimLab 3D IC thermal-structural warpage and solder-life workflowSupplier / solution source: Altair
- CV8511C / CV5788 low-warpage encapsulation for FOWLP and PLPSupplier / solution source: Panasonic Industry
- FLX-2320-S / FLX-3300-T thermal thin-film stress metrologySupplier / solution source: Toho Technology
- kSA MOS ThermalScan temperature-dependent wafer curvature and film-stress metrologySupplier / solution source: k-Space Associates
- Marc nonlinear thermo-mechanical and interface-contact simulationSupplier / solution source: MSC Software, now part of Cadence
- VIC-3D full-field 3D deformation and strain measurementSupplier / solution source: Correlated Solutions
- Interposer PoP low-warpage dual-substrate stacked packageSupplier / solution source: Amkor Technology
- PIMEL photosensitive polyimideSupplier / solution source: Asahi Kasei
- Custom high-density IC substratesSupplier / solution source: AT&S
- Desmond molecular simulation for packaging polymersSupplier / solution source: Schrodinger
18 candidate solutions
Local interface voids after hybrid bonding
Correlate defect locations with pre- and post-bond data to separate particle, flatness, wafer-warpage, and bonding-condition effects.
Current candidates
- EchoScan void detection systemSupplier / solution source: Onto Innovation
- Dragonfly G3 2D / 3D inspection and metrologySupplier / solution source: Onto Innovation
- Advanced-packaging inspection and metrology solutionsSupplier / solution source: KLA
- C-SAM scanning acoustic microscopy platformSupplier / solution source: Nordson Test & Inspection
- Hybrid-bonding equipment and integration solutionsSupplier / solution source: EV Group
- PSL2300C CMP slurry for copper hybrid bondingSupplier / solution source: FUJIFILM Electronic Materials
- Reflexion LK copper/dielectric CMP planarizationSupplier / solution source: Applied Materials
- SB8 Gen2 permanent-wafer bonding developmentSupplier / solution source: SUSS MicroTec
- AUDIRA acoustic-AFM subsurface feature assessmentSupplier / solution source: Nearfield Instruments
- Entegris copper CMP polishing slurriesSupplier / solution source: Entegris
- Entegris NexPlanar CMP padsSupplier / solution source: Entegris
- EchoScan immersion-free bond-void inspectionSupplier / solution source: Onto Innovation
- JSR CMP polishing slurriesSupplier / solution source: JSR
- Contract acoustic interface inspection and reportingSupplier / solution source: PVA TePla
- Coronus wafer-bevel residue and protectionSupplier / solution source: Lam Research
- Foveros Direct 3D chiplet integration with Cu-to-Cu hybrid bondingSupplier / solution source: Intel Foundry
- Kinex integrated die-to-wafer hybrid bonding systemSupplier / solution source: Applied Materials
- XP8 DCM PECVD dielectric depositionSupplier / solution source: ASM International
11 candidate solutions
Rising thermal resistance during power cycling
Track thermal, electrical, and imaging metrics together to distinguish die attach, interconnects, and external thermal interfaces.
Current candidates
- D9650Z power-module acoustic inspection systemSupplier / solution source: Nordson Test & Inspection
- Power-semiconductor failure-analysis servicesSupplier / solution source: EAG Laboratories
- Power cycling, thermal models, and qualification guidanceSupplier / solution source: Infineon
- Simcenter Micred T3STER transient thermal characterizationSupplier / solution source: Siemens Digital Industries Software
- ETS-88 power-device and module electrical comparisonSupplier / solution source: Teradyne
- Phase 12 device thermal characterizationSupplier / solution source: Analysis Tech
- NI integrated power cycling and monitoringSupplier / solution source: NI
- PCT3 calibrated power-cycling monitoringSupplier / solution source: SCHLETZ GmbH
- MX300-C controlled thermal cycling comparisonSupplier / solution source: Kewell Technology
- PowerLab mission-specific cycling serviceSupplier / solution source: Fraunhofer IZM
- Simcenter Micred Power Tester for power cycling and failure-in-progress monitoringSupplier / solution source: Siemens Digital Industries Software
11 candidate solutions
Post-mold die shift and RDL misalignment in fan-out packages
Register pre- and post-mold die coordinates to evaluate displacement compensation, warpage, and RDL alignment separately.
Current candidates
- Panel Level Packaging process and alignment researchSupplier / solution source: Fraunhofer IZM
- IC Packaging simulationSupplier / solution source: Moldex3D
- Flip-chip on FO-WLP flow comparisonSupplier / solution source: imec
- LITHOSCALE die-shift-compensating exposureSupplier / solution source: EV Group
- DW-3100 die-shift-compensated direct imagingSupplier / solution source: SCREEN Semiconductor Solutions
- JetStep panel RDL projection lithographySupplier / solution source: Onto Innovation
- TSMC InFO integrated fan-out packagingSupplier / solution source: TSMC
- Meister D die-placement inspectionSupplier / solution source: Koh Young Technology
- Firefly G5 panel-level packaging inspection and 3D metrologySupplier / solution source: Onto Innovation
- M-Series fan-out with Adaptive PatterningSupplier / solution source: Deca Technologies
- CLIP chip-last panel-level fan-out packagingSupplier / solution source: Powertech Technology Inc. (PTI)
8 candidate solutions
Temperature-dependent errors in chiplet die-to-die links
Confirm lane observability, then separate electrical margin from physical package-interconnect changes.
Current candidates
- UCIe 2.0 DFx and manageability evaluationSupplier / solution source: UCIe Consortium
- Chiplet PHY Designer 2025Supplier / solution source: Keysight
- SLM UCIe MTR IP for die-to-die monitoring, test and repairSupplier / solution source: Synopsys
- HFSS 3D electromagnetic analysis of package transitionsSupplier / solution source: Ansys, part of Synopsys
- V93000 EXA Scale electrical testing of observable device interfacesSupplier / solution source: Advantest
- PrimeSim HSPICE channel and receiver-margin comparisonSupplier / solution source: Synopsys
- Amkor package design characterizationSupplier / solution source: Amkor Technology
- EMIB local-silicon-bridge 2.5D multi-die packagingSupplier / solution source: Intel Foundry
11 candidate solutions
Underfill voids and post-cure delamination in large multi-die packages
Inspect filling, curing, and interface integrity separately. Material claims cannot replace defect validation.
Current candidates
- ASYMTEK underfill dispensing workflowSupplier / solution source: Nordson Electronics Solutions
- LOCTITE ECCOBOND UF 9000AESupplier / solution source: Henkel
- C-SAM microelectronic interface inspectionSupplier / solution source: Nordson Test & Inspection
- ASYMTEK Vantage underfill dispensing and process controlSupplier / solution source: Nordson Electronics Solutions
- CHIPCOAT U8439-1 capillary underfill for large ICsSupplier / solution source: NAMICS
- Ultra C vac narrow-gap flux cleaningSupplier / solution source: ACM Research
- PCO pressure cure for package adhesivesSupplier / solution source: Heller Industries, Inc.
- MA-tek liquid particle-aggregation serviceSupplier / solution source: MA-tek
- MCR 503 adhesive rheology and cure monitoringSupplier / solution source: Anton Paar
- DCAT liquid surface and interfacial tensionSupplier / solution source: DataPhysics Instruments
- FineSAT III acoustic package inspectionSupplier / solution source: Hitachi High-Tech
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