Your solution map
Post-mold die shift and RDL misalignment in fan-out packages
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
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Your solution map
Check the problem definition, then choose which solutions to explore.
2 priority paths11 candidate solutions12 sources
BLNKK's current understanding
Please check the details- Package architecture
- Fan-out / FOPLP; die-first or RDL-first flow unconfirmed
- Observation
- Post-mold die coordinates differ from RDL design locations
- Process stage
- Molding, curing, carrier release, and RDL exposure
- Variables to validate
- Carrier, temporary fixation material, mold compound, die distribution, and coordinate calibration
- Missing information
- Stepwise displacement maps, rotation, panel topography, alignment tolerance, and thermal history
Paths to assess first
Paths serve different purposes and can be combined01
Die-position metrology and RDL compensationIdentify translation, rotation, and local alignment errors
First02
Mold-flow and cure analysisEvaluate molding-flow and material dependencies
First03
Carrier and packaging-flow comparisonConfirm the process window after compensation
LaterCurrent candidate solutions
Sample suitability still needs confirmationAlignment and process researchPanel Level Packaging process and alignment researchFraunhofer IZM · Can help answer: Which stage requires position compensation?
→Molding simulationIC Packaging simulationMoldex3D · Can help answer: Do molding-condition changes alter displacement trends?
→Architecture researchFlip-chip on FO-WLP flow comparisonimec · Can help answer: Does forming interconnects first change the alignment issue?
→Next: confirm engineering conditionsUse 3 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →