BGA drop-induced pad cratering: How should the next round of comparisons be designed?

First retain original and normal pads, and align actual fractured layers with local board loading.

Substrate fracture beneath padsBoard bending and dropLocal loading

Problem context and interpretation

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Which layer contains the original crack, and what artifact controls are used during component removal and sampling?
Are fixture points and local board waveforms aligned with cracks?
How are layer stack, pads, thermal history, and pull / shear methods controlled, and how is transfer calibrated?

Reference sourcesASE：Failure Analysis Lab ↗

Technical Q&A awaiting input

Which layer contains the original crack, and what artifact controls are used during component removal and sampling?
Are fixture points and local board waveforms aligned with cracks?
How are layer stack, pads, thermal history, and pull / shear methods controlled, and how is transfer calibrated?

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BGA drop-induced pad cratering: How should the next round of comparisons be designed?

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