Board-level BGA solder-joint fatigue under thermal cycling: How should the next round of comparisons be designed?

First retain initially normal contacts, and establish shared coordinates for staged electrical / crack measurements and sample temperatures.

BGA thermal cyclingAccumulated solder cracksStand-off comparisons

Problem context and interpretation

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How are initially formed contacts and crack paths at successive stages localized?
Are sample temperatures, dwell and ramp conditions, and board support comparable?
How are contact location, stand-off, crystal orientation, and thermal history controlled?

Reference sourcesASE：Failure Analysis Lab ↗

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How are initially formed contacts and crack paths at successive stages localized?
Are sample temperatures, dwell and ramp conditions, and board support comparable?
How are contact location, stand-off, crystal orientation, and thermal history controlled?

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Board-level BGA solder-joint fatigue under thermal cycling: How should the next round of comparisons be designed?

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