Does the thermal model need a revised film conductivity, interface thermal resistance or measurement assumption? First determine which parameters can be independently identified.

Local heat-transfer parameters of advanced-packaging films, bond layers and buried solid interfaces

• Actual stack, layer thicknesses, material anisotropy and optical/sampling access
• Effects of the transducer and specimen preparation on the target interface
• Transient data, sensitivity, calibration specimens and measurement uncertainty
• Hybrid-bonding subcase: Cu area fraction, bonding/annealing history, and electrical/void comparisons

• Does the thermal model need a revised film conductivity, interface thermal resistance or measurement assumption? First determine which parameters can be independently identified.
• Select film/interface measurements such as time-domain thermoreflectance for the specimen and assess sensitivity
• Compare parameter combinations using multiple thicknesses or controlled-bonding comparisons and held-out validation data