Microbump height variation and coplanarity: How should the next round of comparisons be designed?

First retain the prebond array and local reference, and build maps at the same coordinates before and after plating or reshaping.

Microbump heightPrebond coplanarityPlating and reshaping

Problem context and interpretation

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How do point-by-point heights separate reference tilt, die bow, and actual bump variation?
At which stage before or after plating and reshaping do outliers first appear?
What sample validation establishes the grading window for this receiving surface and tool?

Reference sourcesKLA：Zeta-300 Optical Profiler ↗

Technical Q&A awaiting input

How do point-by-point heights separate reference tilt, die bow, and actual bump variation?
At which stage before or after plating and reshaping do outliers first appear?
What sample validation establishes the grading window for this receiving surface and tool?

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Microbump height variation and coplanarity: How should the next round of comparisons be designed?

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