Should mounting locations, support stiffness and preload distribution change, or should the existing mounting system be retained? Define load-induced deformation before addressing thermal contact.

Assembled package, cold plate or heatsink, mounting hardware and force-transfer path

• Mounting geometry, support and measured force/displacement records
• Topography before loading, after loading and after unloading at the same temperature
• Approved package mechanical limits, contact maps and model boundaries

• Should mounting locations, support stiffness and preload distribution change, or should the existing mounting system be retained? Define load-induced deformation before addressing thermal contact.
• Repeatable loading/unloading comparisons within the approved load range
• Calibrate the assembly-contact and preload mechanical model, retaining independent thermal and displacement observations