Copper-clip attachment integrity in power devices: How should the next comparison round be designed?

How is the anomaly correlated with the die and leadframe ends of the clip above the die?

Upper copper-clip attachmentBondline thickness and displacementInitial and post-stress comparisons

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How is the anomaly correlated with the die and leadframe ends of the clip above the die?
What matched records exist for materials, metallization, bondline thickness, and actual attachment / clamping?
How can local electrical behavior and interfaces be compared initially and after stress using the same contact boundary conditions?

Reference sourcesDing Yandoc / Nexperia：How Copper Clip Makes Perfect Packages for the Future of Power ↗

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How is the anomaly correlated with the die and leadframe ends of the clip above the die?
What matched records exist for materials, metallization, bondline thickness, and actual attachment / clamping?
How can local electrical behavior and interfaces be compared initially and after stress using the same contact boundary conditions?

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Copper-clip attachment integrity in power devices: How should the next comparison round be designed?

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