Pad misalignment and electrical opens after hybrid bonding: How should the next controlled comparison be designed?

First establish shared coordinates for pad/mark calibration, open-circuit locations and bonding history.

Pad misalignmentPost-bond overlayElectrical opens

Problem context and interpretation

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Are mark-to-pad calibration and measurement uncertainty traceable?
Can an open be localized to a net, die or individual contact?
How can local residuals after the global transform be separated from patterns on both sides and bond-interface conditions?

Reference sourcesEV Group：EVG40 D2W announcement ↗

Technical Q&A awaiting input

Are mark-to-pad calibration and measurement uncertainty traceable?
Can an open be localized to a net, die or individual contact?
How can local residuals after the global transform be separated from patterns on both sides and bond-interface conditions?

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Pad misalignment and electrical opens after hybrid bonding: How should the next controlled comparison be designed?

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