How do we separate contact and cooling effects from packaged-SoC failures during high-temperature workload tests?

Check the failure mode, test coverage, contact and actual device temperature before preparing reproducible functional tests and fault localization.

Device functional, burn-in and stress-test failures

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Establish test observability and contact/thermal controls before comparing ATE, SLT and controlled burn-in

Retain raw pass/fail data, electrical metrics and control devices; final yield alone is insufficient.
Check fixtures, sockets/probes, instrument ranges and test coverage; ATE and SLT are different tests.
Setpoint temperature is not junction temperature; document self-heating, cooling, voltage and safe limits.

Reference sourcesAehr Test Systems：FOX-XP wafer, bare-die and module burn-in and test ↗

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How do we separate contact and cooling effects from packaged-SoC failures during high-temperature workload tests?

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How do we separate contact and cooling effects from packaged-SoC failures during high-temperature workload tests?

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