Power wire-bond lift-off and heel fatigue: How should the next comparison round be designed?

How is the wire-bond electrical path correlated with feet / heels and normal joints?

Wire-bond lift-offHeel cracksElectrical and fracture-surface correlation

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How is the wire-bond electrical path correlated with feet / heels and normal joints?
Can original, decapsulated, and staged samples establish preparation and local-load limitations?
How can bonding, geometry, and pull / shear loading modes be compared using the same structure?

Reference sourcesZeng et al. / Infineon author repository：First results of development of a lifetime model for transfer molded discrete power devices ↗

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How is the wire-bond electrical path correlated with feet / heels and normal joints?
Can original, decapsulated, and staged samples establish preparation and local-load limitations?
How can bonding, geometry, and pull / shear loading modes be compared using the same structure?

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Power wire-bond lift-off and heel fatigue: How should the next comparison round be designed?

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