FPA-8000iW panel packaging lithography
Canon Semiconductor Equipment · Process equipment and thermal control
- Purpose
- Fine-line panel-level packaging needs consistent imaging and overlay over large areas while managing incoming panel warpage during handling and exposure.
- Technical approach
- FPA-8000iW is a 365 nm i-line stepper using projection optics for field-by-field panel exposure. A Vacuum Assist Unit is listed as an option for warped-panel handling.
- Scope of use
- Canon positions it for large-panel PLP exposure: 515 × 510 mm is the de facto size and the table lists a 515 × 515 mm maximum. Resist, pattern and panel geometry need process-window confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsResolution/overlay ratings are not automatically the achieved resist linewidth, spacing or defect-free interconnects. Warpage shape, resist and alignment marks affect acceptance; the 10 mm handling description is not a guarantee for arbitrary panel profiles.
What to prepareBLNKK suggests preparing panel material, size/thickness and warpage profiles, resist/exposure conditions, linewidth/spacing targets and overlay budgets, plus short locations, pattern measurements and handling failures.
Confirm with the supplierConfirm field choice, resolution/overlay acceptance conditions, resist/focus window, supported panels for Vacuum Assist, and limits on warped-panel handling and exposure.
- Public evidence
- The page lists ≤1.0 µm resolution, 52 × 68 mm or 55 × 65 mm fields and ≤200 nm overlay. The June 23, 2020 release also describes handling up to 10 mm panel warpage, subject to confirmation for the actual panel/configuration.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.