Singulator MDS plasma dicing platforms

Plasma-Therm · Process equipment and thermal control

Purpose: Evaluate plasma singulation as an alternative to sawing thin wafers, with attention to streets, sidewalls and downstream die handling.
Technical approach: ICP etching uses endpoint detection and substrate temperature control. Routes include on-tape dicing, temporary carriers and plasma dicing before grinding.
Scope of use: For thin-wafer, advanced-packaging and MEMS singulation. Wafer/frame support depends on the MDS model and handling configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Etch compatibility depends on streets, masks and stack materials. Supplier sidewall/strength claims do not establish residue-free processing or guaranteed yield for every stack.
What to prepare
BLNKK suggests preparing thickness, street cross-sections, masks and tape/carrier details. Define residue, damage, depth and downstream handling acceptance checks.
Confirm with the supplier
Confirm PDOT/PDOC/PDBG route and model/frame support, then street-metal removal, selectivity, endpoint control, temperature control and trial-sidewall measurements.
Public evidence: Official pages describe MDS hardware and control. The PDBG page separately explains partial street etching followed by grinding to separate dies.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.