UltraFLEXplus SoC electrical test platform
Teradyne · Reliability qualification and failure analysis
- Purpose
- Reproduces packaged-device electrical failures under specified conditions to compare coverage and failure observability.
- Technical approach
- Configurable power, digital, high-speed and other instruments execute measurements through IG-XL test programs.
- Scope of use
- SoC, processor and high-speed interface testing, with the test head, DIB, contacts and instruments selected for the device and program.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsInstrument specifications are not an all-inclusive system configuration. Electrical screening does not independently diagnose cracks/delamination or complete burn-in/reliability qualification.
What to prepareBLNKK suggests preparing test programs, DFT observability, power and interface needs, DIB and contact information, temperature conditions and failure records.
Confirm with the supplierConfirm base system, instruments, fixtures, program compatibility and calibration, then verify coverage and failure-reproduction methods.
- Public evidence
- Teradyne describes different base systems and named power, digital, SERDES/HSIO and RF instruments separately.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.