LOCTITE ECCOBOND UF 9000AE underfill for large dies
Henkel · Material properties and interface engineering
- Purpose
- Protect under-die interconnects in large flip-chip BGA and Cu-pillar packages while assessing solder stress and warpage from thermal mismatch. Evaluate filling quality alongside subsequent reliability.
- Technical approach
- Liquid epoxy fills the die-substrate gap by capillary flow and cures into a protective support around interconnects. Henkel positions low CTE, low resin bleed-out and low die warpage as product features.
- Scope of use
- Intended for large flip-chip BGA and Cu-pillar packages, including Pb-free/low-k applications; Henkel also describes AI/HPC packaging examples. Verify suitability for the actual die size, gap, surfaces and cure equipment.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsLow-warpage and reliability statements do not qualify your package; 260°C describes reflow capability, not continuous operating temperature. Published cure profiles are guidance and require application validation.
What to prepareBLNKK suggests preparing die size, gap/interconnect layout, surface treatment, reflow/cure history and existing void/warpage data. Define fill quality, reliability and rework needs before sample trials.
Confirm with the supplierAsk Henkel about current supply specifications, storage/thawing, dispensing/cure guidance and compatibility. Agree on application tests for voiding, warpage, thermal cycling and rework.
- Public evidence
- The product page and November 2024 TDS list capillary flow, low CTE and 260°C Pb-free reflow capability. The 2024 release describes commercialization and supplier trials; the TDS states that its data are reference information, not guaranteed specifications.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.