Bancera coating for semiconductor molds

TOWA Corporation · Material properties and interface engineering

Purpose: Consider Bancera where mold fouling, wear or release behaviour is relevant to molding-quality investigations.
Technical approach: The proprietary rare-earth-oxide ceramic surface uses controlled coating structure for wear, fouling and release properties; it is not molding-parameter control.
Scope of use: For compatible semiconductor mold chases and other molds after checking metallurgy, heat treatment, dimensions and sealing surfaces.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Coating is not a guarantee of restored sealing gaps. Published 400–450°C treatment and 2.8–3.2 µm thickness require substrate/tolerance checks and process-specific trials.
What to prepare
BLNKK suggests preparing metallurgy/heat treatment, drawings, wear/fouling maps and release logs; compare dimensions, surfaces and trial molding before/after treatment.
Confirm with the supplier
Confirm treatment size, masking, adhesion/roughness, stripping/recoating and heat-treatment compatibility. Agree on dimensional, release, cleaning and molding acceptance checks.
Public evidence: TOWA publishes coating properties and hard-chrome comparisons. These do not establish your mold’s lifetime, cleaning interval or flash reduction.

Contact the supplier

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