ASSEMBLYLINE integrated optical alignment and attachment

ficonTEC · Process equipment and thermal control

Purpose: Optical loss after fixation requires comparing before/after attachment performance, rather than only peak power during alignment.
Technical approach: ASSEMBLYLINE integrates optical alignment with configured epoxy attachment, eutectic die bonding or laser-assisted soldering, in standalone cells or inline systems.
Scope of use: PIC and fiber-related assembly, with modules selected for coupling geometry, component feeding, fixation materials and production needs.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Attachment methods and test modules depend on configuration. Integrated alignment/attachment does not guarantee zero fixation shift or establish CPO thermal reliability.
What to prepare
BLNKK suggests documenting component/fiber dimensions, coupling targets, fixation materials and metallization, fixtures and cure history, with before/after optical power and position measurements.
Confirm with the supplier
Confirm alignment axes, optical measurements, attachment/feeding modules and material compatibility. Ask which functions are optional and how fixation drift and subsequent thermal testing will be assessed.
Public evidence: The A-22/04en document describes alignment and attachment methods; automatic tool change, wafer handling and TESTLINE functionality are optional modules.

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