PowerCu Soft thick copper bonding wire and ribbon

Heraeus Electronics · Material properties and interface engineering

Purpose: Compare copper wire/ribbon options during power-module bond-fatigue evaluation under defined loads and metallization.
Technical approach: Special processing produces soft copper for wedge bonding; material, tool and process settings need joint consideration.
Scope of use: For power interconnects, including supplier-listed SiC, GaN and IGBT applications, with compatible pads, equipment and loop space.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Wire specifications do not establish ribbon dimensions or joint life. Switching from aluminum requires renewed checks of pad damage, bond quality and cycling failure modes.
What to prepare
BLNKK suggests preparing metallization, wire/ribbon dimensions, loop geometry, current/temperature cycles and existing strength/failure data for matched-load trials.
Confirm with the supplier
Confirm available sizes, actual wire or ribbon specifications, tooling and pad/die-top requirements. Discuss trial settings, supplier test conditions and project-specific qualification.
Public evidence: The official page and wire factsheet describe applications and material characteristics. Comparative lifetime tests do not guarantee equivalent module gains.

Supporting references

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