Sigrity PowerSI package-PDN frequency-domain analysis

Cadence · Thermo-mechanical simulation and lifetime prediction

Purpose: Package/board PDN impedance, resonances and decoupling need comparison with observed load-transient problems.
Technical approach: PowerSI extracts coupled signal, power and ground networks from layout, producing frequency-dependent impedance and S-parameters and analyzing plane resonances.
Scope of use: Frequency-domain SI/PI modeling for IC packages, PCBs and SiPs, using consistent geometry, materials, ports and component models.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A frequency-domain network alone does not reproduce arbitrary droop. Load/VRM models, a suitable time-domain workflow and measurement correlation are needed; export, frequency coverage and licenses require confirmation.
What to prepare
BLNKK suggests preparing layout, stack-up, frequency-dependent materials, ports/reference planes, decoupling models and load events, with impedance or transient measurements.
Confirm with the supplier
Confirm version, extraction/export formats, Broadband SPICE licensing, time-domain integration and convergence checks. Correlate a representative PDN before using results for decisions.
Public evidence: Cadence documents extraction, decoupling assessment and models for time-domain simulation. Broadband SPICE model generation is optional.

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