BERGQUIST TGF 3600 curable thermal gap filler

Henkel Adhesive Technologies · Material properties and interface engineering

Purpose: Degrading thermal-interface contact calls for evaluating whether a curable filler retains contact in the actual assembly gap.
Technical approach: Two-part silicone TGF 3600 cures at room or elevated temperature into a low-modulus elastomer between components and heatsinks/housings.
Scope of use: Low-stress interfaces with fragile components, topography or assembly tolerances, after checking gap and material compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It is not a structural adhesive or a universal thin-TIM replacement. Pump-out-resistant design does not establish retention under every cycling condition.
What to prepare
BLNKK suggests documenting gaps, tolerances, clamping, surfaces and curing, with before/after thermal resistance, contact and material-position checks.
Confirm with the supplier
Confirm mixing/dispensing, cure conditions, compatibility and representative durability data. Distinguish typical properties from supply specifications.
Public evidence: Henkel’s December 2025 TDS describes conformability and pump-out resistance by design, excludes structural adhesive use, and labels properties/cure schedules as reference guidance.

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