Voltus 3D-IC EM and IR-drop analysis

Cadence · Electromagnetic and electrical simulation

Purpose: 3D-IC microbump power paths require current, voltage-drop and temperature comparisons to assess power-network risks.
Technical approach: Voltus analyzes power, EM and IR drop with die/interposer/package models for 3D-IC co-simulation, integrating with system and thermal tools.
Scope of use: 3D-IC power networks with usable design/extracted models, workloads, interconnect definitions and process rules for the actual stack.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Results depend on models, workloads and rules; simulation alone does not prove physical microbump damage or lifetime. Complete stack/thermal workflows may require other tools and licenses.
What to prepare
BLNKK suggests documenting networks, microbump/TSV models, current activity, temperatures and process rules, with available measurements.
Confirm with the supplier
Confirm stack-specific models/extraction, EM rules, thermal-data exchange, tool responsibilities and licensing.
Public evidence: Cadence’s product page explicitly covers 3D-IC co-simulation. Its October 7, 2024 article separates Integrity planning, Voltus chip-centric signoff and Sigrity system signoff.

Supporting references

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