OM-based D-coupon reflow continuity testing service

Oneida Research Services · Reliability qualification and failure analysis

Purpose: Microvias may regain continuity at room temperature, concealing resistance changes during reflow.
Technical approach: OM applies convection-reflow or thermal-shock profiles while measuring D-coupon daisy chains with four-wire resistance readings once per second per net.
Scope of use: Board/organic-substrate evaluation using representative via, stack and process coupons, with agreed profiles and interpretation criteria.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
One-second sampling may miss shorter interruptions; chain resistance cannot independently locate a failed microvia interface. Published generic profiles/thresholds are not automatic project acceptance criteria.
What to prepare
BLNKK suggests documenting stacks, vias, fabrication and chain design, reflow conditions, interruption duration and resistance baselines to assess coupon representativeness.
Confirm with the supplier
Confirm substrate/coupon suitability, actual profiles, sampling, agreed thresholds, reporting and subsequent failure-analysis options.
Public evidence: Oneida’s service page documents D-coupons, OM measurements and reports containing thermal profiles and resistance changes.

Contact the supplier

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