PlanarClean copper post-CMP cleaning solution

Entegris · Materials and interface control

Purpose: Post-barrier-CMP residue or copper-surface changes call for comparing cleaning, corrosion and surface-condition outcomes.
Technical approach: Aqueous PlanarClean works with brushing, rinsing and drying to remove residues while controlling copper corrosion; the supplier provides ambient-temperature guidance.
Scope of use: Copper post-CMP processing, after checking actual residues and film compatibility against the listed copper/dielectric applications.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Public evidence does not qualify arbitrary hybrid-bond stacks. Cleaning cannot replace roughness, chemistry or activation measurements, or promise removal of every residue.
What to prepare
BLNKK suggests documenting residues, films, dilution, brush/rinse/dry and queue conditions, with before/after surface and corrosion comparisons.
Confirm with the supplier
Obtain current safety/use documents and confirm compatibility, recipes, chemical-delivery conditions and evaluation data rather than directly adopting the reference flow.
Public evidence: The product page and actual January 2018 datasheet describe compatibility and reference processing, noting that customized recipes may be necessary.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.