PCS-CR-10 phase-change thermal-interface sheet
Shin-Etsu Chemical · Material properties and interface engineering
- Purpose
- Heatsink contact resistance requires comparing conformity and compressed thickness rather than initial sheet thickness alone.
- Technical approach
- Silicone-based PCS-CR-10 softens with heat and conforms to uneven surfaces under suitable contact pressure.
- Scope of use
- Electronic component/heatsink interfaces with confirmed heating, clamping, thickness and electrical-isolation requirements.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCompressed data follow one hour at 50 psi/100°C, not arbitrary assembly conditions. This grade has no listed dielectric-breakdown value; TIM data do not qualify structural fixation.
What to prepareBLNKK suggests documenting surfaces, gaps, clamping, heating and actual bond-line thickness, comparing initial and aged contact resistance.
Confirm with the supplierConfirm sheet/compression windows, insulation requirements, contact/material retention under cycling and representative assembly evaluation methods.
- Public evidence
- The named table specifies pressure/temperature/time conditions and labels values as non-specifications; compressed data are not package-level thermal resistance.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.