CoolTherm MD-140 SP conductive die-attach adhesive

Parker Lord · Material properties and interface engineering

Purpose: Assess thin-bondline die-attach voids and quality against dispensing, surface conditions and actual cure histories.
Technical approach: CoolTherm MD-140 SP is a silver-filled electrically conductive adhesive that heat-cures into a thin attachment layer.
Scope of use: Supplier-listed thermally demanding die attach accepting conduction, with compatible materials and cure conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Typical catalog values are not formal specifications or proof of actual cure. Do not borrow other grades' low-modulus/aging claims or directly replace insulation; this does not repair existing voids.
What to prepare
BLNKK suggests preparing die/carrier/surfaces, thickness, deposit and measured thermal history, with void, strength and post-cycle comparisons.
Confirm with the supplier
Confirm current MD-140 SP TDS/supply, storage, cure, adhesion and reliability conditions before defining thin-bondline trials and acceptance.
Public evidence: The 2023 PC3003 Rev.6 catalog specifically documents MD-140 SP application, properties and cure schedules.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.