DW-3100 die-shift-compensated direct imaging
SCREEN Semiconductor Solutions · Process equipment and thermal control
- Purpose
- Assess whether fan-out RDL exposure patterns can accommodate actual die positions and substrate distortion.
- Technical approach
- DW-3100 uses GLV maskless direct imaging and image-based recognition of warpage, distortion and die displacement for wafer/chip-specific exposure.
- Scope of use
- Supplier-listed advanced-packaging wafers and square panels; dimensions, resist compatibility and correction windows require confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsResolution is not overlay accuracy or correction range; universal values are not disclosed. Exposure compensation does not reposition dies; verify actual RDL alignment and connectivity.
What to prepareBLNKK suggests preparing displacement/rotation maps, substrate distortion, alignment marks, resist stacks and RDL dimension/overlay targets.
Confirm with the supplierConfirm formats, metrology/exposure integration, resist windows, correction limits and acceptance methods before representative exposure trials and measurements.
- Public evidence
- SCREEN's December 3, 2025 release documents compensation and claims 1 µm-or-less resolution from updated optics.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.