SB-3300 wafer-backside cleaning and controlled etch
SCREEN Semiconductor Solutions · Process equipment and thermal control
- Purpose
- Evaluate backside particle cleaning and controlled etching as wafer-shape process options.
- Technical approach
- Brush and chemical cleaning combine with backside etch control and a proprietary chuck that protects the device side.
- Scope of use
- SCREEN identifies 300 mm wafers; film, thin-wafer and carrier compatibility need project confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsNo film-specific recipe or warp-reduction value is published. Backside wafer treatment does not establish package thermal-warpage improvement.
What to prepareBLNKK suggests preparing both-side film stacks, wafer thickness, particles and bow measurements, plus permitted removal and front-side contact limits.
Confirm with the supplierConfirm compatible films, chemical selectivity, thin-wafer handling, front-side protection and acceptance measurements for particles, removal and wafer shape.
- Public evidence
- The December 2025 catalog names SB-3300 cleaning, backside warp control and device-side protection.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.