VERSALINE HDRF sidewall polymer/resist removal
Plasma-Therm · Process equipment and thermal control
- Purpose
- Identify post-silicon-etch sidewall polymer/resist residues before assessing removal and surface compatibility.
- Technical approach
- VERSALINE HDRF uses downstream high-density radical chemistry for resist strip, surface treatment and post-DSE polymer removal.
- Scope of use
- The HDRF section lists 50–200 mm wafers and 80–250°C hardware range; dicing frames, tape and thin-die compatibility require confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsListed uses do not establish universal residue removal or no-damage packaging performance. Hardware ranges do not qualify materials, tape or actual sample thermal windows.
What to prepareBLNKK suggests preparing residue composition/location, sidewalls, masks, tape/carriers and thermal budget, with before/after residue and surface-chemistry comparisons.
Confirm with the supplierConfirm chemistry, temperature/time, carriers and compatibility; discuss oxidation, residues and downstream adhesion or strength acceptance.
- Public evidence
- Plasma-Therm separately documents HDRF mechanism, applications and configuration on the VERSALINE page.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.