TersOnus RDL seed-metal wet etch

Yield Engineering Systems · Process equipment and thermal control

Purpose: Compare post-plating seed-metal removal for RDL electrical isolation.
Technical approach: Configurable wet-metal etching uses onboard chemical management and optional bulk chemical delivery.
Scope of use: YES identifies wafer/panel processing, Cu/Ti/TiW/Ru and seed etch; actual stacks and formats need confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
No target-stack selectivity or undercut result is published. Seed removal does not establish that plated bridges or other short mechanisms are resolved.
What to prepare
BLNKK suggests preparing film stacks, thickness, line/space dimensions and residue maps, plus permitted line loss and isolation acceptance criteria.
Confirm with the supplier
Confirm chemistry, uniformity, undercut/selectivity, wafer/panel handling and post-clean residue/electrical verification.
Public evidence: The named TersOnus Metal Etch section explicitly lists metals and seed removal.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.