KMC low-warpage, thermally conductive epoxy encapsulants
Shin-Etsu Chemical · Material properties and interface engineering
- Purpose
- Encapsulation must balance protection, heat transfer and moldability. Material expansion, stiffness and curing conditions also affect stress and warpage, making grade selection package-dependent.
- Technical approach
- KMC is an epoxy encapsulant family offered in powder or tablet forms. Select a grade through its thermal conductivity, expansion, modulus and molding properties for the intended process.
- Scope of use
- Official materials list semiconductor-device, wafer-molding and power-device uses, with compression and transfer-molding examples. Match the process, material form and package to a specific grade.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsFamily positioning does not mean every grade delivers the same low-warpage and high-conductivity performance. Historical catalogue data and reliability tests on specific specimens do not replace validation of the current material in the actual package.
What to prepareBring package dimensions and stack-up, molding/cure conditions, heat paths, operating temperatures, warpage targets and current material issues to compare grades and plan representative trials.
Confirm with the supplierConfirm currently supplied grades, current conductivity/CTE/modulus data and molding/post-cure conditions. Request package-relevant warpage, adhesion and reliability data, plus current sample, storage and handling guidance.
- Public evidence
- The product page gives family-level low-stress, low-warpage and high-conductivity positioning. The 2009 brochure lists grades and properties; power-device data give TO-220 test conditions, not universal package guarantees.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.