LSG1040 laser package singulation

TOWA Corporation · Process equipment and thermal control

Purpose: Package-kerf heat-damage assessment needs laser-condition and sidewall-quality comparisons.
Technical approach: LSG1040 uses non-contact, water-free dry laser singulation for non-rectangular packages.
Scope of use: A package-singulation candidate; confirm mold/substrate materials, thickness and cutting paths.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Non-contact, water-free processing is not heat-free or compatible with arbitrary wafers. Read sources do not guarantee damage, thickness or strength for a target stack.
What to prepare
BLNKK suggests documenting stack/streets, laser/scanning settings and existing defects, with sidewall, heat-affected-zone, contamination and strength comparisons.
Confirm with the supplier
Confirm materials/thickness, laser configuration, paths and parameter window, together with debris handling, inspection and sample acceptance criteria.
Public evidence: The named page lists twin lasers/tables; the May 2025 release describes dry processing and flexible package shapes.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.