CPM1080/CPM1180 wafer and panel compression molding
TOWA Corporation · Process equipment and thermal control
- Purpose
- Assess resin encapsulation for large wafers and panels, including fill quality, molded thickness and loading on thin dies. Molding quality and subsequent warpage need validation with the actual materials and package structure.
- Technical approach
- Compression molding immerses the devices in resin before curing, with resin supply and handling configured by model. Published CPM1080-HP features include uniform resin dispensing, improved thickness flatness and higher vacuum levels.
- Scope of use
- TOWA lists 300 mm wafers and 320 × 320 mm panels for CPM1080, and panels up to 625 × 620 mm for CPM1180. HBM, 2.5D/3D and chiplet applications are specifically listed for CPM1080-HP; confirm the required model and configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsThe equipment alone does not guarantee low warpage or void-free molding; resin, substrate, die layout and cure/cooling conditions still matter. Series-level dimensions and features do not apply to every configuration.
What to prepareBLNKK suggests preparing workpiece dimensions, package cross-sections, die layouts, resin data, target thickness and existing defect records. For warpage evaluation, include before/after molding and temperature-dependent measurements where available.
Confirm with the supplierAsk TOWA to confirm the model, automation, resin compatibility, tooling/handling needs and proposed process conditions. Agree on a trial acceptance plan covering thickness uniformity, voiding, warpage and cycle time for your product.
- Public evidence
- The molding overview and CPM product page identify dimensions, resin support and automation variants, including advanced-packaging applications for CPM1080-HP. These are supplier capability statements, not validation of warpage, voiding or throughput for your product.
Supporting references
Contact the supplier
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.