Henkel LOCTITE ABLESTIK 84-1LMI conductive die attach

Henkel Adhesive Technologies · Material properties and interface engineering

Purpose: Initial die-attach coverage review needs controlled surfaces, gaps and dispensing before comparing voids/electrical behavior.
Technical approach: LOCTITE ABLESTIK 84-1LMI is a silver-filled heat-cured epoxy dispensed into a conductive die-attach layer.
Scope of use: Microelectronic die bonding is documented; validate substrates, gaps, thaw/use times and actual cure history.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Published values are typical and cure profiles guidelines, not void-free or assembly-qualification guarantees. Control trapped air/contamination during transfer and dispensing.
What to prepare
BLNKK suggests preparing die/substrate surfaces, gaps/supports, patterns, thaw/use/cure histories and coverage/void/electrical references.
Confirm with the supplier
Confirm current TDS, storage/thaw/work life, actual bondline temperature, coverage/void measurements and adhesion/electrical acceptance.
Public evidence: The actual TDS documents material/dispensing and thaw/cure guidance; current packaging content still names this grade.

Supporting references

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