Heraeus AP500X fine-pitch flip-chip flux

Heraeus Electronics · Process equipment and thermal control

Purpose: Flip-chip bridging review should control solder volume/geometry before comparing surfaces, flux and reflow collapse.
Technical approach: Heraeus AP500X is a water-soluble flux for fine-pitch attach, with aqueous post-reflow cleaning.
Scope of use: Flip-chip, bumping and BGA attach are documented; validate dose, surfaces, reflow and narrow-gap cleaning on actual specimens.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Flux cannot guarantee no bridging or repair existing shorts, nor replace solder-volume/placement checks. Validate cleaning access and residues for actual gaps.
What to prepare
BLNKK suggests preparing bumps/pads, solder volume, surface/oxidation, flux dose, reflow/collapse, cleaning history and bridge/residue observations.
Confirm with the supplier
Confirm current formulation/supply, application, surfaces/reflow window, narrow-gap cleaning, ionic/residue assessment and normal/abnormal comparisons.
Public evidence: The official page and Version 2022 factsheet document flux uses and cleaning; demonstrated results have specific specimen conditions.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.