Heraeus Welco AP520 advanced packaging solder paste

Heraeus Electronics · Process equipment and thermal control

Purpose: Fine-pitch bridging assessment needs controlled solder deposits, alignment and pad spacing.
Technical approach: Water-soluble Welco AP520 supplies printed solder for reflow joints; the named factsheet covers SAC305 T7/T6.
Scope of use: Official applications include fine-pitch components/flip-chip SiP attach; confirm powder grade, alloy and printing conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Examples do not guarantee arbitrary apertures/stacks or bridge/void-free multiple reflows, or repair existing shorts. Assess cleaning access separately.
What to prepare
BLNKK suggests stencil/aperture/pad, grade/deposit, alignment and reflow records, with cleaning, bridging/void and reliability comparisons.
Confirm with the supplier
Confirm available alloy/grade, printing/staging windows, reflow/cleaning conditions, current product data and sample-validation methods.
Public evidence: The Version: 2022 factsheet documents condition-specific print/reflow examples and DI-water cleaning.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.