Dow DOWSIL 7920-LV die attach adhesive

Dow · Material properties and interface engineering

Purpose: Initial die-attach void assessment needs controlled bondline, surfaces and cure conditions.
Technical approach: DOWSIL 7920-LV is a one-part, flowable, low-viscosity heat-curing adhesive for die attachment.
Scope of use: The stated use is microelectronics adhesion; validate actual die/substrate surfaces and downstream compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Solventless is not void-free and does not repair existing voids. Attachment use does not establish thermal/electrical conductivity or surface-specific adhesion guarantees.
What to prepare
BLNKK suggests surfaces, bondline, dispensing/placement force, temperature-at-part cure and storage histories, with initial void/adhesion comparisons.
Confirm with the supplier
Confirm current material data, compatibility, cure window/part temperature, storage/handling and void/downstream-validation methods.
Public evidence: The named page lists heat cure, low modulus, solventless formulation and common-substrate adhesion.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.