TMA, DMA and DSC thermal characterization for advanced-packaging materials
iST Integrated Service Technology · Reliability qualification and failure analysis
- Purpose
- CTE, Tg and modulus values from different methods or specimen states can produce misleading comparisons and thermomechanical model inputs for molds, underfills, adhesives and substrates.
- Technical approach
- Select TMA for dimensional change, DMA for mechanical response and DSC for heat flow and transitions, obtaining method-specific thermal expansion, glass-transition or modulus data.
- Scope of use
- Supports material selection, supplier-data comparisons and simulation inputs, as well as incoming or failed-sample comparisons. Match the method to material form, direction and thermal history.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSpecimen data are not automatically effective in-package properties or a complete failure/life explanation. State the Tg/modulus definition; thermal pretreatment can change thermoset cure state, so erasing thermal history is not a universal preparation step.
What to prepareBring material/cure state, specimen source and direction, thermal history, relevant temperatures and properties, original datasheets and the comparison objective to discuss suitable methods and sampling.
Confirm with the supplierAgree specimen dimensions and pretreatment, standards, ramp/load conditions, Tg definition, repeatability and access to raw curves. For FEA, discuss available temperature/frequency data and any constitutive-model fitting required.
- Public evidence
- The dated 2023 article explains Tg definitions and thermal history. TMA, DMA and DSC service pages describe dimensional, viscoelastic and heat-flow analyses, with capabilities tied to the method and specimen.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.