Heraeus Condura metal-ceramic power substrates

Heraeus Electronics · Package architecture and warpage compensation

Purpose: Compare substrate surfaces and support conditions for silver-sinter attachment and warpage.
Technical approach: Active-metal-brazed copper on silicon nitride provides insulation, heat conduction and power-device routing/support.
Scope of use: Condura.prime/ultra offer different AMB options; confirm finishes against actual paste, attachment and support conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Heraeus specifies warpage only after initial samples for the actual layout, size and materials. Ceramic properties do not establish assembly lifetime or void-free joints.
What to prepare
BLNKK suggests preparing stack/layout/finish, paste and pressure/temperature windows with cross-section/warpage controls.
Confirm with the supplier
Confirm grade, latest specifications, compatibility, layout acceptance, sampling and joint/reliability validation.
Public evidence: The product page and April 2025 guidelines document surface options, silver-sintering surface development and conditional warpage.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.